We Have Composed, Created, and Described Two-Dimensional16x16-Component Capacitive Micro Machined Ultrasonic Transducer (Cmut)Exhibits. the Cmut Cluster Elements Have a 250-Μm Pitch, and When Tried Indrenching, Have a 5-Mhz Focus Recurrence and 99% Fragmentary Bandwidth. Thecreation Procedure Is Dependent Upon Standard Silicon Micromachining Systemsand Consequently Has the Focal Points of High Yield, Ease, and Simplicity Ofreconciliation. the Transducers Have a Si3n4 Film and Are Created on a 400-Μmthick Silicon Substrate. a Low Parasitic Capacitance Through-Wafer By Means Ofinterfaces Every Cmut Component to a Flip-Chip Bond Cushion on the Rear of Thewafer. Each Through-Wafer By Means of Is 20 Μm In Measurement and 400 Μmprofound. the Interconnects Structure Metal-Encasing Semiconductor (Mis)Intersections With the Encompassing High-Resistivity Silicon Substrate Tosecure Disengagement and to Lessen Parasitic Capacitance. Each Through-Wafer By Means of Has Under 0.06 Pf Ofparasitic Capacitance. We Have Researched an Au-In Flip-Chip Holdingmethodology to Unite the 2D Cmut Exhibit to a Specially Coordinated Circuit(Ic) With Transmit and Accept Electronics. to Create This Methodology, Wecreated Fan Out Structures on Silicon, and Flip-Chip Fortified These Test Kicksthe Bucket to a Level Surface Covered With Gold. the Normal Arrangement Safetyfor Every Knock Is About 3 Ohms, and 100% Yield Is Gotten For What Added Up To30 Knocks. Capacitive Micro Machined Ultrasonic Transducers (Cm ...